SnAgCu合金和镀锡的晶须形成——最新研究成果综述

2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2015-12-03 DOI:10.1109/SIITME.2015.7342356

R. Bátorfi, B. Illés, O. Krammer

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引用次数: 2

摘要

锡晶须的外观代表了无铅焊接技术中一个非常重要的可靠性问题，因为在电子装配线进行最终测试和检查后，锡晶须需要数月或数年的时间才能生长并最终导致故障。为了避免这种隐藏的机制，必须进行研究，以确定不同材料在不同条件和载荷下的晶须倾向。本文综述了有关晶须形成的最新知识，以及尚未测试的可能影响其生长的因素。最后，为未来的实验确定了一些悬而未决的问题。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Whisker formation from SnAgCu alloys and tin platings - review on the latest results

The appearance of tin whiskers represent a highly important reliability issue at lead free soldering technology, because after the final testing and check in the electronics assembly line, it takes months or years for them to grow and to finally cause a failure. To avoid this hidden mechanism, investigations have to be made to determine the whiskering tendency of different materials at different conditions and loads. The paper gives an overview of the latest knowledge about whisker formation, the yet tested factors which might influence their growth. Finally, some open questions are determined for future experiments.

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2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME)

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