蓝宝石上硅技术

Y. Nishi
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引用次数: 5

摘要

存取存储器、可编程逻辑阵列、非易失性存储器等。SOS结构的主要困难,如获得具有可接受的电学特性和相当好的晶体完美性的外延硅薄膜,似乎从实用的角度解决了在SOS晶圆上制造MOS晶体管的问题。通过在n沟道和p沟道晶体管之间没有任何寄生双极晶体管效应的高密度CMOS LSI,以及由于扩散层与铝和/或多晶硅层互连的寄生电容降低而具有更高速度的n沟道MOS LSI,证实了SOS结构与体硅结构相比的基本优势。然而,在开发更高级版本的SOS lsi之前,仍然存在一些应该揭示的现象。本文将回顾目前的艺术状态,并讨论SOS技术的可行性,看看以下感兴趣的事项。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Silicon on Sapphire technology
access memory, a programmable logic array, a nonvolatile memory etc. The primary difficulties of the SOS structure, such as obtaining the epitaxial silicon films with acceptable electrical characteristics and with reasonably good crystal perfection, seem to be solved from the practical point of view for fabrica¬ tion of MOS transistors on SOS wafer. Basic superiority of the SOS structure compared with the bulk silicon structure has been confirmed through the high density CMOS LSI without any parasitic bipolar transistor effects between n-channel and p-channel transistors, and n-channel MOS LSI with higher speed due to decrease in parasitic capacitance of interconnections of both diffused layers and aluminum and/or polycrystal silicon layers. However, there still remain a number of phenomena which should be revealed prior to development of more advanced version of SOS LSIs. This paper will review the present state of the art, and discuss feasibility of SOS technology, looking at the following matters of interest.
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