采用0.25um CMOS技术实现20V非对称互补电源器件

T. Letavic, R. Cook, R. Brock, H. Effing, R. Einerhand
{"title":"采用0.25um CMOS技术实现20V非对称互补电源器件","authors":"T. Letavic, R. Cook, R. Brock, H. Effing, R. Einerhand","doi":"10.1109/ISPSD.2005.1488027","DOIUrl":null,"url":null,"abstract":"This paper presents a process flow in which a 20V-class of power devices is added to baseline 0.25mum CMOS technology by forming asymmetric extended-drain device structures in which shallow-trench-isolation (STI) is incorporated within the device unit cell, forming a gate extended-drain dielectric region. The Rsp-BVds figure-of-merit is consistent with best-in-class for this device construction (0.16 mOhm cm2/24V), and the isolated high-voltage diode capability make this process cost-effective for implementation of mobile power management circuit topologies, including multiple-output DC-DC converters, battery chargers, linear regulators, audio power amplifiers, and white-light backlighting systems","PeriodicalId":154808,"journal":{"name":"Proceedings. ISPSD '05. The 17th International Symposium on Power Semiconductor Devices and ICs, 2005.","volume":"32 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2005-05-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"11","resultStr":"{\"title\":\"20V Asymmetric Complementary Power Device Implementation within a 0.25um CMOS Technology for Power Management\",\"authors\":\"T. Letavic, R. Cook, R. Brock, H. Effing, R. Einerhand\",\"doi\":\"10.1109/ISPSD.2005.1488027\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents a process flow in which a 20V-class of power devices is added to baseline 0.25mum CMOS technology by forming asymmetric extended-drain device structures in which shallow-trench-isolation (STI) is incorporated within the device unit cell, forming a gate extended-drain dielectric region. The Rsp-BVds figure-of-merit is consistent with best-in-class for this device construction (0.16 mOhm cm2/24V), and the isolated high-voltage diode capability make this process cost-effective for implementation of mobile power management circuit topologies, including multiple-output DC-DC converters, battery chargers, linear regulators, audio power amplifiers, and white-light backlighting systems\",\"PeriodicalId\":154808,\"journal\":{\"name\":\"Proceedings. ISPSD '05. The 17th International Symposium on Power Semiconductor Devices and ICs, 2005.\",\"volume\":\"32 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2005-05-23\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"11\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings. ISPSD '05. The 17th International Symposium on Power Semiconductor Devices and ICs, 2005.\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISPSD.2005.1488027\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings. ISPSD '05. The 17th International Symposium on Power Semiconductor Devices and ICs, 2005.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISPSD.2005.1488027","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 11

摘要

本文提出了一种工艺流程,其中20v级功率器件通过形成非对称扩展漏极器件结构添加到基线0.25m CMOS技术中,其中浅沟槽隔离(STI)在器件单元胞内合并,形成栅极扩展漏极介电区。Rsp-BVds的性能指标与同类器件的最佳性能相一致(0.16 mOhm cm2/24V),并且隔离高压二极管的性能使该工艺在移动电源管理电路拓扑的实施中具有成本效益,包括多输出DC-DC转换器、电池充电器、线性稳压器、音频功率放大器和白光背光系统
本文章由计算机程序翻译,如有差异,请以英文原文为准。
20V Asymmetric Complementary Power Device Implementation within a 0.25um CMOS Technology for Power Management
This paper presents a process flow in which a 20V-class of power devices is added to baseline 0.25mum CMOS technology by forming asymmetric extended-drain device structures in which shallow-trench-isolation (STI) is incorporated within the device unit cell, forming a gate extended-drain dielectric region. The Rsp-BVds figure-of-merit is consistent with best-in-class for this device construction (0.16 mOhm cm2/24V), and the isolated high-voltage diode capability make this process cost-effective for implementation of mobile power management circuit topologies, including multiple-output DC-DC converters, battery chargers, linear regulators, audio power amplifiers, and white-light backlighting systems
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:604180095
Book学术官方微信