Analysis of Layered Shielding for Capacitive Wireless Power Transfer Application

Capacitive wireless power transfer (CPT) offers the potential for a variety of applications, ranging from consumer electronics to military applications because of the use of electric fields instead of magnetic fields for power transfer. In this work, three distinct shielding materials (Cu, Al, and Zr) were investigated for solid shielding and multi-layered shielding anal-ysis to reduce radiation exposure to electronics and humans. Despite the fact that typical single-layer shielding can work well, three-layer shielding performed better in this investigation in terms of decreasing the field values on the receiving side. With two proposed layered shielding techniques, the field values were lowered to 151.28 V/m and 169.71 V/m from 309.56 V/m and 279.50 V/m for solid shielding with copper and aluminum. Ansys HFSS finite element analysis was utilized to calculate the field for four shields, two of which consist of Cu and Zr layered shielding. The study demonstrates that layered shielding is superior in terms of field distribution and field exposure outside the shielding. Concerning the efficacy of this various shielding strategies, additional research is required with a focus on Specific Absorption Rate (SAR) estimation.