3d异构集成电路

2013 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S) Pub Date : 2013-10-01 DOI:10.1109/S3S.2013.6716514

C. Chen, D. Yost, B. Aull, C. Chen, P. Gouker, J. Knecht, B. Tyrrell, K. Warner, B. Wheeler, P. Wyatt, C. Keast, V. Suntharalingam

{"title":"3d异构集成电路","authors":"C. Chen, D. Yost, B. Aull, C. Chen, P. Gouker, J. Knecht, B. Tyrrell, K. Warner, B. Wheeler, P. Wyatt, C. Keast, V. Suntharalingam","doi":"10.1109/S3S.2013.6716514","DOIUrl":null,"url":null,"abstract":"Presents a collection of slides covering the following topics: bonding; 3D integrated circuit process flow; lithographic requirements; 3-tier single-photon laser-radar focal plane; Nyquist-limited IR focal planes; CMOS technology and SWIR detectors.","PeriodicalId":219932,"journal":{"name":"2013 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2013-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"3D-enabled heterogeneous integrated circuits\",\"authors\":\"C. Chen, D. Yost, B. Aull, C. Chen, P. Gouker, J. Knecht, B. Tyrrell, K. Warner, B. Wheeler, P. Wyatt, C. Keast, V. Suntharalingam\",\"doi\":\"10.1109/S3S.2013.6716514\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Presents a collection of slides covering the following topics: bonding; 3D integrated circuit process flow; lithographic requirements; 3-tier single-photon laser-radar focal plane; Nyquist-limited IR focal planes; CMOS technology and SWIR detectors.\",\"PeriodicalId\":219932,\"journal\":{\"name\":\"2013 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S)\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2013-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2013 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/S3S.2013.6716514\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2013 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/S3S.2013.6716514","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 2

摘要

展示一系列幻灯片，涵盖以下主题:粘合;三维集成电路工艺流程;平版印刷的要求;三层单光子激光雷达焦平面;奈奎斯特限制红外焦平面;CMOS技术和SWIR探测器。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

3D-enabled heterogeneous integrated circuits

Presents a collection of slides covering the following topics: bonding; 3D integrated circuit process flow; lithographic requirements; 3-tier single-photon laser-radar focal plane; Nyquist-limited IR focal planes; CMOS technology and SWIR detectors.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

2013 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S)

自引率

0.00%

发文量