形成多晶圆厂成本降低基础设施的最佳方法及在扩散中应用创新的成本降低技术。

H. Hershkovitz, M. Batra
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引用次数: 0

摘要

在先进的半导体制造业中,资本设备折旧推动了生产产品的重大固定成本。为了在闪存领域保持竞争力,降低成本方面需要关注,并且必须制定计划和行动,以便在技术开发的早期阶段降低晶圆成本。本文提出了一种最著名的描述多工厂成本基础设施的方法(BKM)。该BKM的开发和实施导致了成本的降低,并特别关注了扩散洁净室功能区域应用的各种成本降低技术。迄今为止,英特尔公司在2004年第一季度至2005年第二季度的200毫米网络中,在扩散领域降低了22%的资本成本
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A Best Known Method for Forming a Multi-Fab Cost Reduction Infrastructure and Applying Innovative Cost Reduction Techniques in Diffusion.
In advanced semiconductor manufacturing, capital equipment depreciation drives a significant fixed cost in producing products. In order to remain competitive in the flash memory segment cost reduction aspects need to be in focus and it is imperative to put plans and actions in place in order to reduce the wafer cost in the early stages of the technology development. This paper presents a best known method (BKM) that describes a multi-factory cost infrastructure. The development and implementation of this BKM resulted in cost reduction, and specifically focused on the various cost reduction techniques applied in the diffusion clean room functional area. To date, 22% capital cost reduction has been attained for Intel Corporation in the diffusion area between Q1 '04 to Q2 '05, across the 200 mm network
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