{"title":"形成多晶圆厂成本降低基础设施的最佳方法及在扩散中应用创新的成本降低技术。","authors":"H. Hershkovitz, M. Batra","doi":"10.1109/ASMC.2006.1638791","DOIUrl":null,"url":null,"abstract":"In advanced semiconductor manufacturing, capital equipment depreciation drives a significant fixed cost in producing products. In order to remain competitive in the flash memory segment cost reduction aspects need to be in focus and it is imperative to put plans and actions in place in order to reduce the wafer cost in the early stages of the technology development. This paper presents a best known method (BKM) that describes a multi-factory cost infrastructure. The development and implementation of this BKM resulted in cost reduction, and specifically focused on the various cost reduction techniques applied in the diffusion clean room functional area. To date, 22% capital cost reduction has been attained for Intel Corporation in the diffusion area between Q1 '04 to Q2 '05, across the 200 mm network","PeriodicalId":407645,"journal":{"name":"The 17th Annual SEMI/IEEE ASMC 2006 Conference","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2006-05-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"A Best Known Method for Forming a Multi-Fab Cost Reduction Infrastructure and Applying Innovative Cost Reduction Techniques in Diffusion.\",\"authors\":\"H. Hershkovitz, M. Batra\",\"doi\":\"10.1109/ASMC.2006.1638791\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In advanced semiconductor manufacturing, capital equipment depreciation drives a significant fixed cost in producing products. In order to remain competitive in the flash memory segment cost reduction aspects need to be in focus and it is imperative to put plans and actions in place in order to reduce the wafer cost in the early stages of the technology development. This paper presents a best known method (BKM) that describes a multi-factory cost infrastructure. The development and implementation of this BKM resulted in cost reduction, and specifically focused on the various cost reduction techniques applied in the diffusion clean room functional area. To date, 22% capital cost reduction has been attained for Intel Corporation in the diffusion area between Q1 '04 to Q2 '05, across the 200 mm network\",\"PeriodicalId\":407645,\"journal\":{\"name\":\"The 17th Annual SEMI/IEEE ASMC 2006 Conference\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2006-05-22\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"The 17th Annual SEMI/IEEE ASMC 2006 Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ASMC.2006.1638791\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"The 17th Annual SEMI/IEEE ASMC 2006 Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ASMC.2006.1638791","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A Best Known Method for Forming a Multi-Fab Cost Reduction Infrastructure and Applying Innovative Cost Reduction Techniques in Diffusion.
In advanced semiconductor manufacturing, capital equipment depreciation drives a significant fixed cost in producing products. In order to remain competitive in the flash memory segment cost reduction aspects need to be in focus and it is imperative to put plans and actions in place in order to reduce the wafer cost in the early stages of the technology development. This paper presents a best known method (BKM) that describes a multi-factory cost infrastructure. The development and implementation of this BKM resulted in cost reduction, and specifically focused on the various cost reduction techniques applied in the diffusion clean room functional area. To date, 22% capital cost reduction has been attained for Intel Corporation in the diffusion area between Q1 '04 to Q2 '05, across the 200 mm network