{"title":"物联网安全3D电感器的设计","authors":"Bruce C. Kim, Sang-Bock Cho","doi":"10.1109/ISOCC.2018.8649908","DOIUrl":null,"url":null,"abstract":"This paper describes the design of through-silicon via (TSV)-based inductors for security of Internet-of-Things (IoT). We designed 3D inductors with security hardware using physically unclonable function (PUF) circuit. The secure 3D inductor could be tuned to desirable frequency by using MEMS switches.","PeriodicalId":127156,"journal":{"name":"2018 International SoC Design Conference (ISOCC)","volume":"121 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2018-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Design of 3D Inductors for IoT Security\",\"authors\":\"Bruce C. Kim, Sang-Bock Cho\",\"doi\":\"10.1109/ISOCC.2018.8649908\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper describes the design of through-silicon via (TSV)-based inductors for security of Internet-of-Things (IoT). We designed 3D inductors with security hardware using physically unclonable function (PUF) circuit. The secure 3D inductor could be tuned to desirable frequency by using MEMS switches.\",\"PeriodicalId\":127156,\"journal\":{\"name\":\"2018 International SoC Design Conference (ISOCC)\",\"volume\":\"121 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2018-11-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2018 International SoC Design Conference (ISOCC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISOCC.2018.8649908\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 International SoC Design Conference (ISOCC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISOCC.2018.8649908","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
This paper describes the design of through-silicon via (TSV)-based inductors for security of Internet-of-Things (IoT). We designed 3D inductors with security hardware using physically unclonable function (PUF) circuit. The secure 3D inductor could be tuned to desirable frequency by using MEMS switches.
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