DC/DC模块热分析

2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits Pub Date : 2009-07-06 DOI:10.1109/IPFA.2009.5232619

Wang Yuanchun, Man Weidong, Lv Changzhi, L. Zhiguo, Guo Chunsheng, Li Fei

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引用次数: 3

摘要

不断增加的DC/DC功率密度和峰值温度对其可靠性和性能提出了挑战。热仿真与分析对新一代DC/DC封装设计的发展具有重要意义。本文提出了一种准确、快速的模拟直流/直流模块热分布的方法。利用ANSYS软件对其热分布进行了仿真，并用红外热图像对其进行了验证。这使得降低应力温度峰值的热设计成为可能，从而显著提高DC/DC可靠性。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Thermal analysis of DC/DC module

Ever-increasing DC/DC power density and peak temperature challenge its reliability and performance. Thermal simulation and analysis play a significant role in development of new generation of DC/DC package design. This paper presents an accurate and fast approach to simulate the thermal distribution of a DC/DC module. The thermal distribution is simulated with ANSYS, and verified by infrared thermal images. This made feasible the thermal design to reduce stressing temperature peaks, so improving DC/DC reliability significantly.

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2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits

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