{"title":"微机械克努森泵片上真空","authors":"S. Mcnamara, Y. Gianchandani","doi":"10.1109/SENSOR.2003.1217167","DOIUrl":null,"url":null,"abstract":"This paper describes a single-chip micromachined implementation of a Knudsen pump-a type of vacuum pump that works by the principle of thermal transpiration, has no moving parts, and consequently offers high reliability. A 6-mask process was used to fabricate the pump from a glass substrate and a silicon wafer. A single stage pump and two integrated pressure sensors occupy 1.5 mm/spl times/2 mm. Measurements show that this device can evacuate a cavity to 0.46 atm while operating at atmospheric pressure and using 80 mW input power. Temperature measurements show thermal isolation on the order of 10/sup 4/ K/W between the polysilicon heater used to operate the pump and the rest of the device.","PeriodicalId":196104,"journal":{"name":"TRANSDUCERS '03. 12th International Conference on Solid-State Sensors, Actuators and Microsystems. Digest of Technical Papers (Cat. No.03TH8664)","volume":"2 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2003-06-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"11","resultStr":"{\"title\":\"A micromachined Knudsen pump for on-chip vacuum\",\"authors\":\"S. Mcnamara, Y. Gianchandani\",\"doi\":\"10.1109/SENSOR.2003.1217167\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper describes a single-chip micromachined implementation of a Knudsen pump-a type of vacuum pump that works by the principle of thermal transpiration, has no moving parts, and consequently offers high reliability. A 6-mask process was used to fabricate the pump from a glass substrate and a silicon wafer. A single stage pump and two integrated pressure sensors occupy 1.5 mm/spl times/2 mm. Measurements show that this device can evacuate a cavity to 0.46 atm while operating at atmospheric pressure and using 80 mW input power. Temperature measurements show thermal isolation on the order of 10/sup 4/ K/W between the polysilicon heater used to operate the pump and the rest of the device.\",\"PeriodicalId\":196104,\"journal\":{\"name\":\"TRANSDUCERS '03. 12th International Conference on Solid-State Sensors, Actuators and Microsystems. Digest of Technical Papers (Cat. No.03TH8664)\",\"volume\":\"2 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2003-06-08\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"11\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"TRANSDUCERS '03. 12th International Conference on Solid-State Sensors, Actuators and Microsystems. Digest of Technical Papers (Cat. No.03TH8664)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/SENSOR.2003.1217167\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"TRANSDUCERS '03. 12th International Conference on Solid-State Sensors, Actuators and Microsystems. Digest of Technical Papers (Cat. No.03TH8664)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SENSOR.2003.1217167","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
This paper describes a single-chip micromachined implementation of a Knudsen pump-a type of vacuum pump that works by the principle of thermal transpiration, has no moving parts, and consequently offers high reliability. A 6-mask process was used to fabricate the pump from a glass substrate and a silicon wafer. A single stage pump and two integrated pressure sensors occupy 1.5 mm/spl times/2 mm. Measurements show that this device can evacuate a cavity to 0.46 atm while operating at atmospheric pressure and using 80 mW input power. Temperature measurements show thermal isolation on the order of 10/sup 4/ K/W between the polysilicon heater used to operate the pump and the rest of the device.