V. Petrescu, A. Mouthaan, G. Dima, B. Govoreanu, O. Mitrea, M. Profirescu
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Early resistance change and stress/electromigration evolution in near-bamboo interconnects
A complete description for early resistance change and mechanical stress evolution in near-bamboo interconnects, related to the electromigration, is given in this paper. The proposed model, for the first time, combines the stress/vacancy concentration evolution with the early resistance change of the Al line with a near-bamboo microstructure, which has been proven to be a fast technique for prediction of the MTF of a line compared to the conventional (accelerated) stress.
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