柔性电子用塑料上SiGe的超低温催化结晶

T. Sadoh, J. Park, M. Kurosawa, M. Miyao
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引用次数: 0

摘要

在软性塑料衬底(软化温度:~300°C)上集成各种先进器件的柔性电子器件中,开发一种低温(≤250°C)取向控制大晶粒(<;10 μm) SiGe在绝缘子上形成技术是实现柔性电子器件的必要条件。这是因为与Si相比,SiGe提供了更高的载流子迁移率和优越的光学性能,以及各种功能材料的外延模板。与此相一致,我们一直在开发SiGe的金属诱导结晶。这可以在低温(~250℃)下实现选择性(100)或(111)取向大晶粒(≥20 μm) SiGe[1-4]。本文综述了这种新型生长技术的最新进展。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Ultralow-temperature catalyst-induced-crystallization of SiGe on plastic for flexible electronics
Development of a low-temperature (≤250°C) formation technique of orientation-controlled large-grain (<;10 μm) SiGe on insulator is essential to realize flexible electronics, where various advanced devices are integrated on flexible plastic substrates (softening temperature: ~300°C). This is because SiGe provides higher carrier mobility and superior optical properties compared with Si, as well as epitaxial template of various functional materials. In line with this, we have been developing metal-induced crystallization of SiGe. This achieves selectively (100)- or (111)-oriented large-grain (≥20 μm) SiGe at low temperatures (~250°C) [1-4]. Present paper reviews our recent progress in this novel growth technique.
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