脉冲直流磁控溅射沉积CdTe薄膜的内部应变分析

P. Kamiński, A. Abbas, C. Chen, S. Yilmaz, F. Bittau, J. Bowers, J. Walls
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引用次数: 7

摘要

采用脉冲直流磁控溅射法制备了CdTe薄膜。磁控溅射为光伏薄膜的沉积提供了显著的优势,包括低沉积温度和优异的涂层均匀性。然而,由于相对较高的沉积能量,薄膜容易受到应力的影响。在这项研究中,沉积温度和氩气流量被用来最小化沉积膜中的应力。采用透射电镜(TEM)对薄膜的晶体结构进行了表征,并用x射线衍射(XRD)对薄膜的应变进行了测量。XRD分析表明,在温度约为200°C、氩气流量为60 sccm的条件下沉积CdTe薄膜可以使应力最小化。此外,衬底温度的增加还具有进一步的优势,可以在沉积的薄膜中促进更大的晶粒尺寸,达到500nm。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Internal strain analysis of CdTe thin films deposited by pulsed DC magnetron sputtering
Thin film CdTe was deposited by pulsed dc magnetron sputtering. Magnetron sputtering offers significant advantages for the deposition of thin film photovoltaic including low deposition temperatures and excellent coating uniformity. However the films are susceptible to stress due to the relatively high deposition energy. In this study, deposition temperature and argon gas flows have been used to minimize stress in the deposited films. TEM imaging was used to investigate the crystalline structure of the deposited films and XRD was used to measure strain. XRD analysis showed that stress can be minimized by depositing the CdTe thin film at temperatures of approximately 200°C using relatively high argon gas flows of 60 sccm. Moreover, this increase in substrate temperature has the further advantage of promoting larger grain sizes up to 500nm in the deposited films.
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