电可编程混合wsi基板的高级版本

1993 Proceedings Fifth Annual IEEE International Conference on Wafer Scale Integration Pub Date : 1993-01-20 DOI:10.1109/ICWSI.1993.255249

H. Stopper

{"title":"电可编程混合wsi基板的高级版本","authors":"H. Stopper","doi":"10.1109/ICWSI.1993.255249","DOIUrl":null,"url":null,"abstract":"The electrically programmable interconnection wafer for hybrid wafer scale integration (WSI) or multichip modules (MCMs) depends on three key constituents, which are the antifuse, the thin-film transmission line, and the architecture. Their impact on device performance is explored, and their parametric improvements from early to present and potential future devices are appraised.<<ETX>>","PeriodicalId":377227,"journal":{"name":"1993 Proceedings Fifth Annual IEEE International Conference on Wafer Scale Integration","volume":"48 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1993-01-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":"{\"title\":\"An advanced version of the electrically programmable hybrid-WSI substrate\",\"authors\":\"H. Stopper\",\"doi\":\"10.1109/ICWSI.1993.255249\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The electrically programmable interconnection wafer for hybrid wafer scale integration (WSI) or multichip modules (MCMs) depends on three key constituents, which are the antifuse, the thin-film transmission line, and the architecture. Their impact on device performance is explored, and their parametric improvements from early to present and potential future devices are appraised.<<ETX>>\",\"PeriodicalId\":377227,\"journal\":{\"name\":\"1993 Proceedings Fifth Annual IEEE International Conference on Wafer Scale Integration\",\"volume\":\"48 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1993-01-20\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"5\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"1993 Proceedings Fifth Annual IEEE International Conference on Wafer Scale Integration\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICWSI.1993.255249\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"1993 Proceedings Fifth Annual IEEE International Conference on Wafer Scale Integration","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICWSI.1993.255249","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 5

摘要

用于混合晶圆规模集成(WSI)或多芯片模块(mcm)的可编程互连晶圆取决于三个关键组成部分，即防熔丝、薄膜传输线和架构。探讨了它们对设备性能的影响，并评估了它们从早期到现在的参数改进和潜在的未来设备

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An advanced version of the electrically programmable hybrid-WSI substrate

The electrically programmable interconnection wafer for hybrid wafer scale integration (WSI) or multichip modules (MCMs) depends on three key constituents, which are the antifuse, the thin-film transmission line, and the architecture. Their impact on device performance is explored, and their parametric improvements from early to present and potential future devices are appraised.<>

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1993 Proceedings Fifth Annual IEEE International Conference on Wafer Scale Integration

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