具有包络跟踪功能的多频段Rel9 WCDMA/HSDPA/TDD LTE和FDD LTE收发器

ESSCIRC 2014 - 40th European Solid State Circuits Conference (ESSCIRC) Pub Date : 2014-11-03 DOI:10.1109/ESSCIRC.2014.6942102

S. Tadjpour, P. Rossi, L. Romanò, R. Chokkalingam, H. Firouzkouhi, Feng Shi, M. Leroux, D. Gerna, A. Venca, J. Vasa, B. Ramachandran, B. Brunn, A. Pirola, D. Ottini, A. Milani, E. Sacchi, M. Behera, X. Chen, U. Decanis, Marika Tedeschi, S. DalToso, W. Eyssa, C. Cakir, C. Prakash, Yong He, N. Damavandi, R. Srinivasan, D. Shum, X. Fan, C. Yu, Engin Pehlivanoglu, H. Zarei, A. Loke, G. Uehara, R. Castello, Y. Song

{"title":"具有包络跟踪功能的多频段Rel9 WCDMA/HSDPA/TDD LTE和FDD LTE收发器","authors":"S. Tadjpour, P. Rossi, L. Romanò, R. Chokkalingam, H. Firouzkouhi, Feng Shi, M. Leroux, D. Gerna, A. Venca, J. Vasa, B. Ramachandran, B. Brunn, A. Pirola, D. Ottini, A. Milani, E. Sacchi, M. Behera, X. Chen, U. Decanis, Marika Tedeschi, S. DalToso, W. Eyssa, C. Cakir, C. Prakash, Yong He, N. Damavandi, R. Srinivasan, D. Shum, X. Fan, C. Yu, Engin Pehlivanoglu, H. Zarei, A. Loke, G. Uehara, R. Castello, Y. Song","doi":"10.1109/ESSCIRC.2014.6942102","DOIUrl":null,"url":null,"abstract":"This paper presents a transceiver capable of supporting 2G/3G/4G LTE FDD bands 1-20 and TDD bands 34-41. The chip includes main and diversity receivers, direct conversion transmitter, internal closed loop power control, antenna tuning and Envelope Tracking DAC. It supports Rel 9 dual band dual carrier HSDPA using a second Receive PLL. The Receiver has better than 2.5dB Noise Figure and better than 50dBm IIP2 for all modes. The transmitter uses class AB power mixer for better power consumption. The overall chip is fabricated in TSMC 55nm process and occupies 19mm2 of area and consumes 92mA from the battery at 0dBm transmit power.","PeriodicalId":202377,"journal":{"name":"ESSCIRC 2014 - 40th European Solid State Circuits Conference (ESSCIRC)","volume":"33 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2014-11-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":"{\"title\":\"A multi-band Rel9 WCDMA/HSDPA/TDD LTE and FDD LTE transceiver with envelope tracking\",\"authors\":\"S. Tadjpour, P. Rossi, L. Romanò, R. Chokkalingam, H. Firouzkouhi, Feng Shi, M. Leroux, D. Gerna, A. Venca, J. Vasa, B. Ramachandran, B. Brunn, A. Pirola, D. Ottini, A. Milani, E. Sacchi, M. Behera, X. Chen, U. Decanis, Marika Tedeschi, S. DalToso, W. Eyssa, C. Cakir, C. Prakash, Yong He, N. Damavandi, R. Srinivasan, D. Shum, X. Fan, C. Yu, Engin Pehlivanoglu, H. Zarei, A. Loke, G. Uehara, R. Castello, Y. Song\",\"doi\":\"10.1109/ESSCIRC.2014.6942102\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents a transceiver capable of supporting 2G/3G/4G LTE FDD bands 1-20 and TDD bands 34-41. The chip includes main and diversity receivers, direct conversion transmitter, internal closed loop power control, antenna tuning and Envelope Tracking DAC. It supports Rel 9 dual band dual carrier HSDPA using a second Receive PLL. The Receiver has better than 2.5dB Noise Figure and better than 50dBm IIP2 for all modes. The transmitter uses class AB power mixer for better power consumption. The overall chip is fabricated in TSMC 55nm process and occupies 19mm2 of area and consumes 92mA from the battery at 0dBm transmit power.\",\"PeriodicalId\":202377,\"journal\":{\"name\":\"ESSCIRC 2014 - 40th European Solid State Circuits Conference (ESSCIRC)\",\"volume\":\"33 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2014-11-03\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"5\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"ESSCIRC 2014 - 40th European Solid State Circuits Conference (ESSCIRC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ESSCIRC.2014.6942102\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"ESSCIRC 2014 - 40th European Solid State Circuits Conference (ESSCIRC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ESSCIRC.2014.6942102","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 5

摘要

本文提出了一种能够支持2G/3G/4G LTE FDD频段1-20和TDD频段34-41的收发器。该芯片包括主分集接收机、直接转换发射机、内部闭环功率控制、天线调谐和包络跟踪DAC。它支持Rel 9双频双载波HSDPA使用第二个接收锁相环。在所有模式下，接收机的噪声系数均优于2.5dB, IIP2均优于50dBm。发射机采用AB级功率混频器，功耗更低。整体晶片采用台积电55nm制程制造，面积19mm2，发射功率为0dBm时消耗电池92mA。

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A multi-band Rel9 WCDMA/HSDPA/TDD LTE and FDD LTE transceiver with envelope tracking

This paper presents a transceiver capable of supporting 2G/3G/4G LTE FDD bands 1-20 and TDD bands 34-41. The chip includes main and diversity receivers, direct conversion transmitter, internal closed loop power control, antenna tuning and Envelope Tracking DAC. It supports Rel 9 dual band dual carrier HSDPA using a second Receive PLL. The Receiver has better than 2.5dB Noise Figure and better than 50dBm IIP2 for all modes. The transmitter uses class AB power mixer for better power consumption. The overall chip is fabricated in TSMC 55nm process and occupies 19mm2 of area and consumes 92mA from the battery at 0dBm transmit power.

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来源期刊

ESSCIRC 2014 - 40th European Solid State Circuits Conference (ESSCIRC)

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