金属-铁电-绝缘体-半导体器件温度特性的建模

J. X. Tang, M. H. Tang, F. Yang, J. J. Zhang, Yi Chun Zhou, X. J. Zheng
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引用次数: 2

摘要

本文对金属-铁电-绝缘体-半导体器件的温度特性进行了详细的建模。基于Miller模型,在300 ~ 600 K的宽温度范围内研究了极化、铁电层电场、表面电势和漏源电流随栅极电压的变化。从模型结果中,我们首次发现半导体衬底在不同温度下会导致铁电压印,并且在传递特性曲线中存在与传统金属氧化物半导体器件相同的零温度系数偏置点。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Modeling of temperature characteristics for metal-ferroelectric-insulator-semiconductor devices
Modeling of temperature characteristics for metal-ferroelectric-insulator-semiconductor devices is given in detail in this paper. Based on the Miller model, the polarization, the electric field in ferroelectric layer, surface potential, and drain-to-source current with gate voltage are investigated over a wide temperature range from 300 K to 600 K. From the model results, for the first time, we find that the semiconductor substrate can lead to the ferroelectric imprint under different temperatures, and there exists a zero-temperature-coefficient bias point in the transfer characteristic curves as conventional metal-oxide-semiconductor devices.
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