半导体工业用光谱薄膜厚度测量系统

Conference Proceedings. 10th Anniversary. IMTC/94. Advanced Technologies in I & M. 1994 IEEE Instrumentation and Measurement Technolgy Conference (Cat. No.94CH3424-9) Pub Date : 1994-05-10 DOI:10.1109/IMTC.1994.352008

M. Horie, N. Fujiwara, M. Kokubo, N. Kondo

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引用次数: 4

摘要

精确的薄膜厚度控制是制造无缺陷半导体器件必不可少的。此外，最近的高集成度要求同时测量多层中的每个薄膜厚度和光学常数。本文介绍了一种微光谱薄膜厚度测量系统，该系统可以在一个非常小的点(直径几微米)以几埃的增量测量薄膜厚度。该系统还可以测量块状晶圆片和SOI晶圆片的薄膜厚度，并确定未知薄膜的光学常数。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Spectroscopic thin film thickness measurement system for semiconductor industries

Accurate film thickness controls are indispensable for manufacturing defect-free semiconductor devices. Moreover, recent high integration requires simultaneous measurement of each film thickness and optical constants in multi-layers. This paper explains a microspectroscopic film thickness measurement system that measures film thickness at a very small spot (several micrometers in diameter) in several angstrom increments. This system also enables you to measure film thickness on bulk wafers and SOI wafers, and determine optical constants of unknown films.<>

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Conference Proceedings. 10th Anniversary. IMTC/94. Advanced Technologies in I & M. 1994 IEEE Instrumentation and Measurement Technolgy Conference (Cat. No.94CH3424-9)

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