硅微机械热剖面仪

Y. Gianchandani, K. Najafi, B. Orr
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引用次数: 7

摘要

本文介绍了一种用块状硅微机械加工的扫描热剖面仪。每个器件由一个金多晶硅热电偶组成,该热电偶由悬挂在器件衬底边缘的探头柄支撑。探头杆由弯曲梁悬挂,并可通过侧向梳状驱动器静电激发成物理运动。可用于在扫描期间提供热偏置的多晶硅加热器位于其底部。基本设计的变化包括将热电偶悬挂在介电隔膜上,并用热电堆代替热电偶。已经开发了一种单面,ic兼容的8掩膜工艺来制造这些器件。使用简单设置获得的测试扫描的初步数据表明,即使使用基本的硅柄器件,温度分辨率也可能优于20/spl度/mC
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Silicon micromachined thermal profilers
This paper presents a class of scanning thermal profilers micromachined from bulk silicon. Each device consists of an Au-polysilicon thermocouple supported by a probe shank overhanging the edge of the device substrate. The probe shank is suspended by flexural beams and can be electrostatically excited into physical motion by lateral comb drives. A polysilicon heater that can be used to provide a thermal bias during the scan lies at its base. Variations of the basic design include suspension of the thermocouple on a dielectric diaphragm, and replacing the thermocouple by a thermopile. A single-sided, IC-compatible 8 mask process has been developed to fabricate these devices. Preliminary data from test scans obtained using a simple set-up indicates that temperature resolution better than 20/spl deg/mC is possible even with basic silicon shank devices.<>
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