HBT温度相关大信号等效电路模型[MMIC振荡器]的参数提取

Peter, D. Seitzer
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引用次数: 17

摘要

研究了一种基于HBT拓扑结构的混合/spl / pi/结构的11节点大信号异质结双极晶体管(HBT)模型。这是第一个电路仿真模型,其中使用热阻和伪温度的概念将温度作为可变仿真参数引入,以解释GaAs的温度依赖热导率。关键模型参数——热阻、传输时间、发射极电阻、基极-发射极和基极-集电极结参数——的温度依赖性和偏置依赖性是利用晶圆热夹测量从20至160/spl℃温度范围内测量的DC和s参数数据中解析提取出来的。这些设备的f/sub t/和f/sub max/值分别为40 GHz。在4.7 GHz的简单振荡器电路上对所提出的模型进行了验证,并将振荡频率和前三次谐波输出功率的温度依赖性与实测数据进行了比较
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Parameter extraction for HBT's temperature dependent large signal equivalent circuit model [MMIC oscillator]
An eleven node large signal heterojunction bipolar transistors (HBT) model in hybrid-/spl pi/ configuration is investigated which is derived from HBT topology. This is the first circuit simulation model where the temperature is introduced as a variable simulation parameter using the concept of thermal resistance and pseudotemperature to account for the temperature dependent thermal conductivity of GaAs. The temperature and bias dependence of key model parameters -thermal resistance, transit time, emitter resistance, base-emitter and base-collector junction parameters- are extracted analytically from measured DC and S-parameter data in the temperature range from 20 to 160/spl deg/C using on wafer thermochuck measurements. The devices have f/sub t/ and f/sub max/ values of 40 GHz each. The verification of the proposed model is carried out on a simple oscillator circuit at 4.7 GHz, where the temperature dependence of oscillation frequency and output power of the first three harmonics is compared to measured data.<>
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