基于分块自适应体偏置算法的过程变化感知DRAM设计

S. Desai, Sanghamitra Roy, Koushik Chakraborty
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引用次数: 6

摘要

像dram这样的大型致密结构特别容易受到进程变化的影响,这可能导致不同存储阵列的延迟变化。然而,对DRAM的变异研究很少。这是因为dram传统上是放置在片外的,由于进程变化而导致的延迟变化不会影响处理器的整体性能。然而,新兴的技术趋势,如三维集成,使用复杂的内存控制器和技术节点的持续扩展,大大减少了DRAM访问延迟。因此,未来的技术节点将广泛采用嵌入式dram。这使得工艺变化成为dram面临的一个关键挑战,必须在当前和即将到来的技术世代中加以解决。在本文中,我们提出了模拟随机和空间变化对大型DRAM阵列结构的影响的技术。我们使用基于灵敏度的门电平工艺变化模型结合统计时序分析来估计工艺变化对DRAM性能和泄漏功率的影响。我们还提出了一种基于模拟退火的Vth分配算法,该算法使用自适应体偏置来提高DRAM结构的良率。在1GB DRAM阵列上应用我们的算法,我们报告DRAM产量平均提高了10.3%。据我们所知,我们的技术是第一个模拟工艺变化对大规模DRAM阵列影响的技术。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Process variation aware DRAM design using block based adaptive body biasing algorithm
Large dense structures like DRAMs are particularly susceptible to process variation, which can lead to variable latencies in different memory arrays. However, very little work exists on variation studies in the DRAM. This is due to the fact that DRAMs were traditionally placed off-chip and their latency changes due to process variation did not impact the overall processor performance. However, emerging technology trends like three dimensional integration, use of sophisticated memory controllers and continued scaling of technology nodes, substantially reduces DRAM access latency. Hence future technology nodes will see widespread adoption of embedded DRAMs. This makes process variation a critical upcoming challenge in DRAMs that must be addressed in current and forthcoming technology generations. In this paper, we present techniques for modeling the effect of random as well as spatial variation in large DRAM array structures. We use sensitivity based gate level process variation models combined with statistical timing analysis to estimate the impact of process variation on the DRAM performance and leakage power. We also propose a simulated annealing based Vth assignment algorithm using adaptive body biasing to improve the yield of DRAM structures. Applying our algorithm on a 1GB DRAM array, we report an average of 10.3% improvement in the DRAM yield. To the best of our knowledge, ours is the first technique to model the impact of process variation on large scale DRAM arrays.
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