An animated interface for X-ray laminographic inspection of fine-pitch interconnect

While the function of solder joint inspection is to assess joint quality, evolving fine-pitch mounting technologies have made some electronic assemblies impossible to inspect using human-oriented visual techniques. A group of automated inspection tools has recently been developed in response to this need, one of which uses X-ray laminography in conjunction with very elaborate software. The authors present the work that has been performed to provide an easy-to-use animated graphics-oriented, X-ray laminographic solder joint inspection system interface. The interface has been developed to aid in the study of performance-related interconnect inspection.<>