{"title":"电磁建模作为多学科设计的组成部分","authors":"N. Buris","doi":"10.1109/EPEP.2004.1407539","DOIUrl":null,"url":null,"abstract":"A scalable framework of multi-disciplined design that is able to accommodate any geometric based design discipline is presented. Of the several challenges in the way of high fidelity, physics based design and modeling are the focus of This work. The complexity of a problem described in its raw geometry is overwhelming. The second challenge discussed in This work is the coupling of most, if not all disciplines in an optimization problem when described at the geometric level. Often, the degree of discipline coupling is a function of the type and level of optimization that one is \"willing\" to pursue, or ignore. Application examples are given in the area of electromagnetic and structural analyses for components appearing in cellular phones.","PeriodicalId":143349,"journal":{"name":"Electrical Performance of Electronic Packaging - 2004","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2004-10-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Electromagnetic modeling as a constituent of multi-disciplined design\",\"authors\":\"N. Buris\",\"doi\":\"10.1109/EPEP.2004.1407539\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A scalable framework of multi-disciplined design that is able to accommodate any geometric based design discipline is presented. Of the several challenges in the way of high fidelity, physics based design and modeling are the focus of This work. The complexity of a problem described in its raw geometry is overwhelming. The second challenge discussed in This work is the coupling of most, if not all disciplines in an optimization problem when described at the geometric level. Often, the degree of discipline coupling is a function of the type and level of optimization that one is \\\"willing\\\" to pursue, or ignore. Application examples are given in the area of electromagnetic and structural analyses for components appearing in cellular phones.\",\"PeriodicalId\":143349,\"journal\":{\"name\":\"Electrical Performance of Electronic Packaging - 2004\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2004-10-25\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Electrical Performance of Electronic Packaging - 2004\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPEP.2004.1407539\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Electrical Performance of Electronic Packaging - 2004","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEP.2004.1407539","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Electromagnetic modeling as a constituent of multi-disciplined design
A scalable framework of multi-disciplined design that is able to accommodate any geometric based design discipline is presented. Of the several challenges in the way of high fidelity, physics based design and modeling are the focus of This work. The complexity of a problem described in its raw geometry is overwhelming. The second challenge discussed in This work is the coupling of most, if not all disciplines in an optimization problem when described at the geometric level. Often, the degree of discipline coupling is a function of the type and level of optimization that one is "willing" to pursue, or ignore. Application examples are given in the area of electromagnetic and structural analyses for components appearing in cellular phones.