Thermal dissipation characteristics of a non-hermetic metal dual in-line package

A study is described that evaluated the benefits of a metal cavity package on junction temperature and examined consequences of die-attach methods on a device's thermal properties. The measurements made to establish some of the factors affecting thermal transfer are outlined. Both infrared (IR) thermography and standard measurement methods were used to determine the thermal resistance for both a standard plastic dual-in-line package (P-DIP) and metal cavity package. The benefits of both approaches in assessing general thermal characteristics of the packages are discussed. The use of a metal cavity package was found to provide an excellent means of heat removal from the base of the die as long as die attach methods are sound, and the die attach medium is thermally conductive. It is also shown that it is possible to examine heat paths from the die to the case both qualitatively and quantitatively by IR thermography.<>