SoC垂直产量坡道的产量管理方法

K. Miyamoto, K. Inoue, I. Tamura, N. Kondo, H. Inoto, I. Ito, K. Kasahara, Y. Oshikiri
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引用次数: 11

摘要

本文提出了一种新的片上系统(System on a Chip)垂直良率坡道(vertical yield ramp)良率管理方法。该方法通过调整试验结构和分析方法,定量分析和优化失效模式,提高良率。为了验证新方法,设计了两种类型的测试芯片来监测和区分影响典型LSI产品芯片的各种失效模式。结果表明,该方法可以同时诊断和改进这几种故障模式,从而实现SoC的VYR。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Yield management methodology for SoC vertical yield ramp
This paper proposes a new yield management method for the SoC (System on a Chip) VYR (vertical yield ramp). In this method, test structures and analysis methods are adjusted to quantitatively analyze and optimize failure modes for improved yield. To verify the new methodology, two types of test chips were designed to monitor and distinguish the various failure modes affecting typical LSI product chips. It is concluded that the new methodology can diagnose and improve these several failure modes simultaneously to achieve the SoC VYR.
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