图形处理器的被动结构快速全波建模

2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems Pub Date : 2011-12-12 DOI:10.1109/EPEPS.2011.6100218

A. Chiariello, A. Maffucci, F. Villone, M. Nicolazzo

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引用次数: 4

摘要

本文提出了一种基于图形处理器(GPU)特性的并行计算方法，以提高被动三维结构的宽带建模速度。全波电磁模型基于表面积分公式，通过对未知数进行零pinv分解在数值上实现。在直流到数百GHz的频率范围内，该数值模型是准确的。该模型的瓶颈是完全填充矩阵的组装和最终的矩阵反演。本文提出了一种矩阵装配阶段的GPU并行化方法，并分析了两个涉及互连全波分析的案例。与传统串行方法相比，实现的加速约为50倍。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Fast full-wave modeling of passive structures with graphic processors

A parallel computation approach based on the properties of the Graphics Processor Units (GPU) is here presented to speed-up the broadband modeling of passive 3D structures. The full-wave electromagnetic model is based on a surface integral formulation, numerically implemented by using a null-pinv decomposition of the unknowns. The numerical model has been proven to be accurate and well-posed for a frequency range from DC to hundreds of GHz. A bottleneck of the model is the assembly of fully populated matrices and the final matrix inversion. This paper presents A GPU parallelization of the matrix assembly phase, and analyzes two case-studies which refer to full-wave analysis of interconnects. The achieved speedup with respect to a conventional serial approach is around 50x.

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2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems

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