辐射加热环形热管的热输出测量

P. Hrabovský
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引用次数: 0

摘要

本文着重研究了液相和气相的相变传热方式。本文描述通过热管的传热装置和用于将热量从热源传递到消耗点的方法。热管是一种在文献中被描述为导热系数比铜高100倍以上的材料的装置。热管是一种节能装置,不需要电力驱动元件(循环泵)。本实验的目的是构造一个环形热管装置。冷却回路的建设,并通过外部冷却源保证足够的冷却能力。热源形式的加热电路的构造及其对热输出的调节。另一个目标是测量设备的输入和输出参数,并计算环路热管的输出热量。该设备本身是一个冷却系统,用于从技术元件中去除产生或废热,例如:电力变压器,生物质和化石燃料燃烧过程,高性能计算机工作站的冷却等。另一个目标是选择合适的传热介质。正确的选择保证了环路热管装置在最佳温度工作环境下的最佳使用,同时最大限度地减少环路热管材料本身与传热介质发生化学反应产生的不凝性气体的形成。这种选择极大地影响了设备的冷却性能。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Measurement of Heat Output of a Loop Heat Pipe with Radiation Heating
The paper focuses on the ways of heat transfer due to the phase-phase change from liquid to gaseous and vice versa. Described herein are heat transfer devices through a heat pipe and methods for transferring heat from a heat source to a point of consumption. A heat pipe is a device described in the literature as a material with more than 100 times higher thermal conductivity than copper. A heat pipe is an energy-efficient device without the need for an electrically powered element (circulation pump). The aim of this experiment is to construct a loop heat pipe device. Construction of the cooling circuit and ensuring sufficient cooling capacity by external cooling sources. Construction of a heating circuit in the form of a heat source and its regulation of heat output. Another objective is to measure the input and output parameters of the device and to calculate the resulting heat output of the loop heat pipe. The device itself is a cooling system for the removal of generated or waste heat from technological elements such as: electrical transformers, biomass and fossil fuel combustion processes, cooling of high-performance computer workstations, etc. Another objective is to select a suitable heat transfer medium. The right choice guarantees the optimal use of the loop heat pipe device in the optimum temperature working environment while minimizing the formation of non-condensable gases generated by the chemical reactions of the loop heat pipe material itself and the heat transfer medium. This selection greatly affects the cooling performance of the device.
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