横向与垂直栅极全能fet的7nm以上技术

D. Yakimets, T. H. Bao, M. Bardon, M. Dehan, N. Collaert, A. Mercha, Z. Tokei, A. Thean, D. Verkest, K. De Meyer
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引用次数: 15

摘要

根据布局和beol负载的不同,在7nm和5nm技术节点的每开关相同能量下,标称LG vfet基RO的运行速度比lfet基RO快60%。使用vfet,可以放松LG,与标称LG情况相比,它会导致额外27%的IEFF。此外,vfet支持不同的布局,可用于优化特定beol负载下的性能。在5nm节点引入vfet比在7nm节点更有利。因此,vfet显示出超过7nm技术的持续扩展的性能竞争路径。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Lateral versus vertical gate-all-around FETs for beyond 7nm technologies
Nominal LG VFET-based RO may operate up to ~60% faster than LFET-based RO at the same energy per switch for both 7nm and 5nm technology nodes depending on the layout and BEOL-load. With VFETs, relaxing the LG is possible and it results in an extra 27% in IEFF in comparison to the nominal LG case. In addition, VFETs enable different layouts, which can be used to optimize performance under certain BEOL-load. Introduction of VFETs is more favorable at the 5nm node than at the 7nm node. As such, VFETs show a performance competitive path for continued scaling beyond 7nm technologies.
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