电镀铁磁薄膜种子层优化的试验结构

2018 IEEE International Conference on Microelectronic Test Structures (ICMTS) Pub Date : 2018-03-19 DOI:10.1109/ICMTS.2018.8383766

C. Dover, A. Ross, S. Smith, J. Terry, A. Mount, A. Walton

{"title":"电镀铁磁薄膜种子层优化的试验结构","authors":"C. Dover, A. Ross, S. Smith, J. Terry, A. Mount, A. Walton","doi":"10.1109/ICMTS.2018.8383766","DOIUrl":null,"url":null,"abstract":"This paper presents a full wafer test structure, designed to quantify the effect of seed layer thickness and conductivity on the plating uniformity of patterned electroplated structures. The test structure enables the effect of IR drop on the electroplated film to be evaluated and provides information to help facilitate the optimisation of seed layer thickness.","PeriodicalId":271839,"journal":{"name":"2018 IEEE International Conference on Microelectronic Test Structures (ICMTS)","volume":"20 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2018-03-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Test structures for seed layer optimisation of electroplated ferromagnetic films\",\"authors\":\"C. Dover, A. Ross, S. Smith, J. Terry, A. Mount, A. Walton\",\"doi\":\"10.1109/ICMTS.2018.8383766\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents a full wafer test structure, designed to quantify the effect of seed layer thickness and conductivity on the plating uniformity of patterned electroplated structures. The test structure enables the effect of IR drop on the electroplated film to be evaluated and provides information to help facilitate the optimisation of seed layer thickness.\",\"PeriodicalId\":271839,\"journal\":{\"name\":\"2018 IEEE International Conference on Microelectronic Test Structures (ICMTS)\",\"volume\":\"20 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2018-03-19\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2018 IEEE International Conference on Microelectronic Test Structures (ICMTS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICMTS.2018.8383766\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 IEEE International Conference on Microelectronic Test Structures (ICMTS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICMTS.2018.8383766","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 2

摘要

本文提出了一种全晶圆测试结构，旨在量化种子层厚度和电导率对图案电镀结构镀层均匀性的影响。测试结构可以评估IR下降对电镀膜的影响，并提供有助于优化种子层厚度的信息。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Test structures for seed layer optimisation of electroplated ferromagnetic films

This paper presents a full wafer test structure, designed to quantify the effect of seed layer thickness and conductivity on the plating uniformity of patterned electroplated structures. The test structure enables the effect of IR drop on the electroplated film to be evaluated and provides information to help facilitate the optimisation of seed layer thickness.

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来源期刊

2018 IEEE International Conference on Microelectronic Test Structures (ICMTS)

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