{"title":"EGSM/DCS/PCS蜂窝电话系统三波段前端模块匹配电路的实用建模与去嵌入程序","authors":"N. Shibagaki, K. Sakiyama, M. Hikkita","doi":"10.1109/ARFTGF.2004.1427583","DOIUrl":null,"url":null,"abstract":"Integration of the antenna front-end module is improved using balanced SAW technology and LTCC technology with sophisticated 3D electromagnetic simulation techniques. New SAW front-end modules for use in EGSM/DCS/PCS triple-band cellular phones have been developed. Conventional RF section designs utilize matching circuits between the front-end module and the RF-IC, which has a complex load impedance. Our new concept front-end module includes the matching circuit for size reduction. Due to the internal matching circuit, the front-end modules are no longer standard 50 ohm system devices. We have demonstrated a practical modeling and de-embedding procedure for the internal RF-IC matching circuit. With this technique, we can evaluate SAW filter characteristics, such as insertion loss, VSWR and amplitude/phase balance, in the nominal output impedance of the SAW filter (e.g.,150 ohm balance) in spite of complex output impedance values for the front-end modules. This modeling technique is useful, not only for inspection of SAW filters for front-end modules, but also for investigating yield problems due to component variations in matching circuits. We believe this technique is useful for developing new concept front-end modules that include matching circuits for the RF-IC.","PeriodicalId":273791,"journal":{"name":"64th ARFTG Microwave Measurements Conference, Fall 2004.","volume":"17 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2004-12-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Practical modeling and de-embedding procedure for matching circuit of triple band front-end module used for EGSM/DCS/PCS cellular phone system\",\"authors\":\"N. Shibagaki, K. Sakiyama, M. Hikkita\",\"doi\":\"10.1109/ARFTGF.2004.1427583\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Integration of the antenna front-end module is improved using balanced SAW technology and LTCC technology with sophisticated 3D electromagnetic simulation techniques. New SAW front-end modules for use in EGSM/DCS/PCS triple-band cellular phones have been developed. Conventional RF section designs utilize matching circuits between the front-end module and the RF-IC, which has a complex load impedance. Our new concept front-end module includes the matching circuit for size reduction. Due to the internal matching circuit, the front-end modules are no longer standard 50 ohm system devices. We have demonstrated a practical modeling and de-embedding procedure for the internal RF-IC matching circuit. With this technique, we can evaluate SAW filter characteristics, such as insertion loss, VSWR and amplitude/phase balance, in the nominal output impedance of the SAW filter (e.g.,150 ohm balance) in spite of complex output impedance values for the front-end modules. This modeling technique is useful, not only for inspection of SAW filters for front-end modules, but also for investigating yield problems due to component variations in matching circuits. We believe this technique is useful for developing new concept front-end modules that include matching circuits for the RF-IC.\",\"PeriodicalId\":273791,\"journal\":{\"name\":\"64th ARFTG Microwave Measurements Conference, Fall 2004.\",\"volume\":\"17 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2004-12-02\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"64th ARFTG Microwave Measurements Conference, Fall 2004.\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ARFTGF.2004.1427583\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"64th ARFTG Microwave Measurements Conference, Fall 2004.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ARFTGF.2004.1427583","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Practical modeling and de-embedding procedure for matching circuit of triple band front-end module used for EGSM/DCS/PCS cellular phone system
Integration of the antenna front-end module is improved using balanced SAW technology and LTCC technology with sophisticated 3D electromagnetic simulation techniques. New SAW front-end modules for use in EGSM/DCS/PCS triple-band cellular phones have been developed. Conventional RF section designs utilize matching circuits between the front-end module and the RF-IC, which has a complex load impedance. Our new concept front-end module includes the matching circuit for size reduction. Due to the internal matching circuit, the front-end modules are no longer standard 50 ohm system devices. We have demonstrated a practical modeling and de-embedding procedure for the internal RF-IC matching circuit. With this technique, we can evaluate SAW filter characteristics, such as insertion loss, VSWR and amplitude/phase balance, in the nominal output impedance of the SAW filter (e.g.,150 ohm balance) in spite of complex output impedance values for the front-end modules. This modeling technique is useful, not only for inspection of SAW filters for front-end modules, but also for investigating yield problems due to component variations in matching circuits. We believe this technique is useful for developing new concept front-end modules that include matching circuits for the RF-IC.