{"title":"RF CMOS紧凑型建模技术从无线通信到物联网应用的足迹","authors":"S. Yoshitomi","doi":"10.23919/MIXDES.2018.8436911","DOIUrl":null,"url":null,"abstract":"This paper reviews the development of compact modeling technology of RF (Radio Frequency) MOSFETs. Author, who was involved in the research and development of RF compact models for many products, will look back the footprints of the important technical issues, which are still essential for the next generation of IoT and wireless applications, and gives outlook of the future related technology developments.","PeriodicalId":349007,"journal":{"name":"2018 25th International Conference \"Mixed Design of Integrated Circuits and System\" (MIXDES)","volume":"90 42 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2018-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Footprints of RF CMOS Compact Modeling Technology From Wireless Communication To IoT Applications\",\"authors\":\"S. Yoshitomi\",\"doi\":\"10.23919/MIXDES.2018.8436911\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper reviews the development of compact modeling technology of RF (Radio Frequency) MOSFETs. Author, who was involved in the research and development of RF compact models for many products, will look back the footprints of the important technical issues, which are still essential for the next generation of IoT and wireless applications, and gives outlook of the future related technology developments.\",\"PeriodicalId\":349007,\"journal\":{\"name\":\"2018 25th International Conference \\\"Mixed Design of Integrated Circuits and System\\\" (MIXDES)\",\"volume\":\"90 42 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2018-06-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2018 25th International Conference \\\"Mixed Design of Integrated Circuits and System\\\" (MIXDES)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.23919/MIXDES.2018.8436911\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 25th International Conference \"Mixed Design of Integrated Circuits and System\" (MIXDES)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/MIXDES.2018.8436911","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Footprints of RF CMOS Compact Modeling Technology From Wireless Communication To IoT Applications
This paper reviews the development of compact modeling technology of RF (Radio Frequency) MOSFETs. Author, who was involved in the research and development of RF compact models for many products, will look back the footprints of the important technical issues, which are still essential for the next generation of IoT and wireless applications, and gives outlook of the future related technology developments.