x射线辐射剂量率对三栅SOI finfet参数的影响

C. Bordallo, F. F. Teixeira, M. Silveira, J. Martino, P. Agopian, E. Simoen, C. Claeys
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引用次数: 2

摘要

本文研究了x射线辐射剂量率对n和p三栅极SOI FinFET器件特性的影响。分析了阈值电压位移、亚阈值斜率位移、最大跨导和离子/IOFF比。在nmugfet中,由于反导的增加,器件的特性总是下降,而对于pmugfet,由于反导的减少,器件的亚阈值区域特性得到改善。较低的x射线辐射剂量率比使用较高的剂量率更有效地捕获电荷和形成界面陷阱。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
The effect of X-Ray radiation dose rate on Triple-Gate SOI FinFETs parameters
In this work, the effect of the X-Ray radiation dose rate on n and p Triple-Gate SOI FinFET device characteristics is investigated. The threshold voltage shift, the subthreshold slope shift, the maximum transconductance and the ION/IOFF ratio were analyzed. In nMuGFETs the characteristics are always degraded due to the increase of the back conduction and for pMuGFETs, the devices have their subthreshold region characteristics improved by the decrease of back conduction. Lower dose rates of X-Ray radiation are shown to be more effective for the trapping of charges and the formation of interface traps than the use of higher doses rates.
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