在晶圆规模环境中的容错能力

R. V. Pelletier, D. Blight, R. McLeod
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引用次数: 3

摘要

提出了提高消息从晶圆的一侧传递到另一侧的概率的方法。这可以通过增加系统中可用处理器的数量,或者换句话说,降低渗透阈值来实现。根据渗流理论框架讨论了几种底层拓扑的影响。本文还介绍了在晶圆规模集成(WSI)处理器阵列中用于消息传递的新路由技术。该算法放弃最短路径路由,以避免网络的故障和拥塞区域。它们基于有偏随机漫步器方法,其中每个数据包的行进方向在每个处理器上由不确定性算法和一组偏置值局部确定。介绍了在多芯片模块中提高连通性的实际应用。这种方法允许一个可重构的晶圆背板,在绕过晶圆>中的故障线方面提供了优势
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Fault tolerance in a wafer scale environment
Methods of improving the probability that a message can be passed from one side of a wafer to another are presented. This is achieved by increasing the number of usable processors in the system or, in other words, lowering the percolation threshold. The impact of several underlying topologies is discussed in terms of a percolation theory framework. Also presented are new routing techniques for message passing in wafer scale integration (WSI) processor arrays. The algorithms forego the shortest path route so as to avoid faulty and congested areas of the network. They are based on a biased random walker approach where the direction each packet travels is determined locally at each processor by a nondeterministic algorithm and a set of bias values. A practical application motivated by improved connectivity in multichip modules is introduced. This method allows for a reconfigurable wafer backplane that provides advantages in bypassing faulty lines in the wafer.<>
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