功率vdmosfet的分割C-V测量特性

P. Habaš, S. Mileusnic, T. Zivanov
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引用次数: 8

摘要

分割C-V测量作为功率vdmosfet的表征方法进行了评估。vdmosfet栅极总电容的测量结果是由电子和空穴的叠加、不同界面区域的积累、耗尽和反转贡献组成的复杂曲线。相反,在分离的C-V测量中,给出栅极-漏极和栅极-源电容,特定界面区域的电子和空穴贡献是分开的。阐明了VDMOS电池的分裂C-V特性和栅极总电容的结构。利用小信号交流分析方法对C-V分裂特性进行二维数值计算,并对来自不同界面区域的栅极电容分量进行准静态数值分析,证实了实验结果的解释。解释了漏源偏置对特性的影响。设想应用:测量vdmosfet的技术参数,以及单独测量辐照后通道和外延区栅氧化物降解水平。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Characterization of power VDMOSFETs by split C-V measurements
Split C-V measurements are evaluated as a characterization method for power VDMOSFETs. The measurement of the gate total capacitance results for VDMOSFETs in a complex curve which is superposition of the electron and hole, accumulation, depletion and inversion contributions of different interface regions. As opposed, in the split C-V measurements, giving gate-drain and gate-source capacitance, the electron and hole contributions of particular interface areas are separated. The structure of the split C-V characteristics and the gate total capacitance of a VDMOS cell is clarified. Interpretation of experimental results is confirmed by numerical 2D calculations of the split C-V characteristics by means of small signal ac analysis, and by numerical quasi-static analysis of the gate-capacitance components which originate from the different interface regions. The impact of the drain-source bias on the characteristics is explained. Applications are envisaged: measurements of technology parameters in VDMOSFETs, and separate measurement of the level of gate oxide degradation in the channel and in the epitaxial region after irradiation.
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