R. Steiner, M. Schneider, F. Mayer, U. Munch, T. Mayer, H. Baltes
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Fully packaged CMOS current monitor using lead-on-chip technology
A compact CMOS monitor system for galvanically isolated current measurement is presented. It is packaged with standard lead-on-chip technology and completely in line with commercial IC production. This technology includes inexpensive and high volume batch fabrication of chips followed by automatic mass packaging. The system has a linear response in a range of /spl plusmn/10 A with a small non-linearity below /spl plusmn/0.3%. This results in a measurement accuracy of better than 50 mA. The accuracy is further improved by soft ferromagnetic field concentrators.
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