LDMOS晶体管的电容建模

E. Griffith, S. C. Kelly, J. A. Power, D. Bain, S. Whiston, P. Elbert, M. O’Neill
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引用次数: 11

摘要

高压集成电路(HVIC)在各种应用中作为分立电路的可行替代品出现。这些电路中常用的高压元件是横向双扩散MOS晶体管(LDMOS)。由于低掺杂漏极的存在以及栅极氧化物和多晶硅在沟道区域以外延伸到漏极区域,使得LDMOS晶体管的建模变得复杂。这种轻微掺杂的漏极对器件的反馈电容有很大的影响。本文将讨论与集成到传统0.6μm CMOS技术中的LDMOS晶体管相关的电容建模。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Capacitance Modelling of LDMOS Transistors
High Voltage integrated circuits (HVIC’s) are emerging as viable alternatives to discrete circuits in a wide variety of applications. A commonly used High Voltage component of these circuits is the lateral double diffused MOS transistor (LDMOS). Modelling the LDMOS transistor is complicated by the existence of the lightly doped drain and by the extension of the gate oxide and polysilicon beyond the channel region into the drain region. This lightly doped drain has a large effect on the feedback capacitance of the device. This paper will discuss the modelling of the capacitances associated with a LDMOS transistor integrated into a conventional 0.6μm CMOS technology.
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