L. Guoguang, Huang Yun, En Yunfei, Yang Shaohua, Lei Zhifeng
{"title":"大功率QCW毫米棒阵列的可靠性","authors":"L. Guoguang, Huang Yun, En Yunfei, Yang Shaohua, Lei Zhifeng","doi":"10.1109/IPFA.2009.5232648","DOIUrl":null,"url":null,"abstract":"We report here the lifetime testing of 10 high power cm-bar arrays using an automated diode array reliability experiment. The devices are tested at 25°C/100A, with a pulse width of 200µs and a duty factor of 2%. Most devices survive more than 1.0×109 shots. Failure analysis results on the few failing devices reveal failure modes of mechanical stress, chemical contamination and thermal migration.","PeriodicalId":210619,"journal":{"name":"2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits","volume":"36 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2009-07-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Reliability of high power QCW cm-bar arrays\",\"authors\":\"L. Guoguang, Huang Yun, En Yunfei, Yang Shaohua, Lei Zhifeng\",\"doi\":\"10.1109/IPFA.2009.5232648\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We report here the lifetime testing of 10 high power cm-bar arrays using an automated diode array reliability experiment. The devices are tested at 25°C/100A, with a pulse width of 200µs and a duty factor of 2%. Most devices survive more than 1.0×109 shots. Failure analysis results on the few failing devices reveal failure modes of mechanical stress, chemical contamination and thermal migration.\",\"PeriodicalId\":210619,\"journal\":{\"name\":\"2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits\",\"volume\":\"36 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2009-07-06\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IPFA.2009.5232648\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IPFA.2009.5232648","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
We report here the lifetime testing of 10 high power cm-bar arrays using an automated diode array reliability experiment. The devices are tested at 25°C/100A, with a pulse width of 200µs and a duty factor of 2%. Most devices survive more than 1.0×109 shots. Failure analysis results on the few failing devices reveal failure modes of mechanical stress, chemical contamination and thermal migration.