高频蚀刻溅射二氧化钛薄膜的记忆行为

Z. Aznilinda, M. Ramly, N. Kamarozaman, S. H. Herman
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引用次数: 0

摘要

本文演示了以TiO2或二氧化钛为有源层的忆阻器件的制备方法和基本物理特性。该记忆器件是在玻璃基板上制作的。采用射频磁控溅射技术在衬底上生长了两层二氧化钛薄膜。第一层是在第二层沉积前用1% HF(氢氟酸)蚀刻的二氧化钛层。蚀刻时间不同;5秒,7秒。在电压回路中测量样品的电流-电压(I-V)曲线,从0V到-5V,从-5V到5V再回到0V,从-5V到5V再回到-5V。实验证明,在7s的温度下,高频蚀刻可以改善材料的记忆性能。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Memristive behavior of HF-etched sputtered titania thin films
This paper demonstrates the fabrication method and reports the essential physical characterization of a memristive device with TiO2 or titania as an active layer. The memristive device was fabricated on glass substrate. Titania thin films were grown in two layers by RF-magnetron sputtering technique onto the substrates. The first layer is a titania layer etched by 1% HF (Hydrofluoric acid) before the deposition of the second layer. The etching time was varied; for 5 seconds and 7 seconds. Current-voltage (I-V) curves of the samples were measured from the voltage loop ranging from 0V to -5V, -5V to 5V then back to 0V and also from -5V to 5V then back to -5V. It was proven that the HF-etch give an improvement in the memristive behavior when it is etched at 7 s.
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