Shuaijie Zhao, Chuantong Chen, M. Ueshima, Motoharu Haga, K. Suganuma
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Chemical bonding copper and epoxy through self-assembled layer
Conventionally, copper and epoxy are bonded by roughening the copper surface. However, a roughed copper surface causes large resistance and delay when the frequency of current increases. Instead of roughing the surface, this work tried to use a self-assembled layer of 4- aminothiophenol (4-ATP) to bond copper and epoxy chemically. The influence of treatment time of copper in 4- APT solution was investigated. The best treatment time is 1 hour. Under this condition, the shear strength between copper and epoxy reached 24 MPa.
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