集成电路拓扑驱动可靠性评估

2018 25th International Conference "Mixed Design of Integrated Circuits and System" (MIXDES) Pub Date : 2018-06-01 DOI:10.23919/MIXDES.2018.8436642

Theodor Hillebrand, S. Paul, D. Peters-Drolshagen

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引用次数: 1

摘要

本文提出了一种从老化角度对集成模拟电路进行优化的结构化方法。给出了该方法中各子块的老化分析。随后，这些区块被用于改善两级Miller-OTA的老化行为。此外，对该方法的整体性能进行了评估，从零开始构建一个几乎不受老化影响的老化补偿放大器。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Topology-Driven Reliability Assessment of Integrated Circuits

In this paper a structured method is presented which optimizes integrated analogue circuits in terms of aging. The aging analyses of each sub block used in the method are presented. Subsequently, these blocks are used to improve the aging behavior of a two-stage Miller-OTA. Moreover, the whole capabilities of the method are evaluated constructing an aging-compensated amplifier from scratch being virtually immune to aging.

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2018 25th International Conference "Mixed Design of Integrated Circuits and System" (MIXDES)

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