基于电子全息技术的硼基低能量高剂量离子注入的二维截面掺杂分析

S. Qin, Zhouguang Wang, Du Li, Y. J. Hu, A. Mcteer, R. Burke, J. Guha
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引用次数: 0

摘要

电子全息技术作为一种强大的二维(2D)掺杂谱分析方法,研究了低能量高剂量离子注入的二维截面掺杂谱,包括常规束流线11B注入和B2H6等离子体掺杂(PLAD)。研究发现,电压为−6kV、剂量为2×1016/cm2的B2H6 PLAD,其结深xj(垂直xj(V))和横向xj(L)均略高于能量为2keV、剂量为5×1015/cm2的束流线11B植入体,其xj(L)/xj(V)比值略大。995°C/20s条件下的RTP过程比1015°C/ 20s条件下的RTP过程表现出更高的热收支,导致更深的xj,但xj(L)/xj(V)之比相似。二维电子全息掺杂谱、二维掺杂谱模拟和一维SIMS/ARXPS B谱之间具有良好的相关性。二维电子全息掺杂谱与器件参数之间有很好的相关性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Two-dimensional cross-sectional doping profiling of boron-based low energy high dose ion implantations using Electron Holography technique
Electron holography, as a powerful method for two-dimensional (2D) doping profiling, is used to study 2D cross-sectional doping profiles of low energy high dose ion implantations including conventional beam-line 11B implant and B2H6 plasma doping (PLAD). It has been found that B2H6 PLAD with −6kV voltage and 2×1016/cm2 dose shows slightly deeper junction depth xj, both of the vertical xj(V), and lateral xj(L) and with slightly larger xj(L)/xj(V) ratio, than beam-line 11B implant with 2keV energy and 5×1015/cm2 dose. RTP process with 995°C/20s condition demonstrates higher thermal budget than 1015°C/spike condition — cause deeper xj, but with a similar xj(L)/xj(V) ratio. Good correlations among 2D Electron Holography dopant profiles, 2D dopant profile simulations, and 1D SIMS/ARXPS B profiles have been demonstrated. Very good correlation between 2D Electron Holography doping profiles and device parameters has been demonstrated.
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