S. Qin, Zhouguang Wang, Du Li, Y. J. Hu, A. Mcteer, R. Burke, J. Guha
{"title":"基于电子全息技术的硼基低能量高剂量离子注入的二维截面掺杂分析","authors":"S. Qin, Zhouguang Wang, Du Li, Y. J. Hu, A. Mcteer, R. Burke, J. Guha","doi":"10.1109/IWJT.2010.5474915","DOIUrl":null,"url":null,"abstract":"Electron holography, as a powerful method for two-dimensional (2D) doping profiling, is used to study 2D cross-sectional doping profiles of low energy high dose ion implantations including conventional beam-line <sup>11</sup>B implant and B<inf>2</inf>H<inf>6</inf> plasma doping (PLAD). It has been found that B<inf>2</inf>H<inf>6</inf> PLAD with −6kV voltage and 2×10<sup>16</sup>/cm<sup>2</sup> dose shows slightly deeper junction depth x<inf>j</inf>, both of the vertical x<inf>j</inf>(V), and lateral x<inf>j</inf>(L) and with slightly larger x<inf>j</inf>(L)/x<inf>j</inf>(V) ratio, than beam-line <sup>11</sup>B implant with 2keV energy and 5×10<sup>15</sup>/cm<sup>2</sup> dose. RTP process with 995°C/20s condition demonstrates higher thermal budget than 1015°C/spike condition — cause deeper x<inf>j</inf>, but with a similar x<inf>j</inf>(L)/x<inf>j</inf>(V) ratio. Good correlations among 2D Electron Holography dopant profiles, 2D dopant profile simulations, and 1D SIMS/ARXPS B profiles have been demonstrated. Very good correlation between 2D Electron Holography doping profiles and device parameters has been demonstrated.","PeriodicalId":205070,"journal":{"name":"2010 International Workshop on Junction Technology Extended Abstracts","volume":"7 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2010-05-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Two-dimensional cross-sectional doping profiling of boron-based low energy high dose ion implantations using Electron Holography technique\",\"authors\":\"S. Qin, Zhouguang Wang, Du Li, Y. J. Hu, A. Mcteer, R. Burke, J. Guha\",\"doi\":\"10.1109/IWJT.2010.5474915\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Electron holography, as a powerful method for two-dimensional (2D) doping profiling, is used to study 2D cross-sectional doping profiles of low energy high dose ion implantations including conventional beam-line <sup>11</sup>B implant and B<inf>2</inf>H<inf>6</inf> plasma doping (PLAD). It has been found that B<inf>2</inf>H<inf>6</inf> PLAD with −6kV voltage and 2×10<sup>16</sup>/cm<sup>2</sup> dose shows slightly deeper junction depth x<inf>j</inf>, both of the vertical x<inf>j</inf>(V), and lateral x<inf>j</inf>(L) and with slightly larger x<inf>j</inf>(L)/x<inf>j</inf>(V) ratio, than beam-line <sup>11</sup>B implant with 2keV energy and 5×10<sup>15</sup>/cm<sup>2</sup> dose. RTP process with 995°C/20s condition demonstrates higher thermal budget than 1015°C/spike condition — cause deeper x<inf>j</inf>, but with a similar x<inf>j</inf>(L)/x<inf>j</inf>(V) ratio. Good correlations among 2D Electron Holography dopant profiles, 2D dopant profile simulations, and 1D SIMS/ARXPS B profiles have been demonstrated. Very good correlation between 2D Electron Holography doping profiles and device parameters has been demonstrated.\",\"PeriodicalId\":205070,\"journal\":{\"name\":\"2010 International Workshop on Junction Technology Extended Abstracts\",\"volume\":\"7 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2010-05-10\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2010 International Workshop on Junction Technology Extended Abstracts\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IWJT.2010.5474915\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2010 International Workshop on Junction Technology Extended Abstracts","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IWJT.2010.5474915","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Two-dimensional cross-sectional doping profiling of boron-based low energy high dose ion implantations using Electron Holography technique
Electron holography, as a powerful method for two-dimensional (2D) doping profiling, is used to study 2D cross-sectional doping profiles of low energy high dose ion implantations including conventional beam-line 11B implant and B2H6 plasma doping (PLAD). It has been found that B2H6 PLAD with −6kV voltage and 2×1016/cm2 dose shows slightly deeper junction depth xj, both of the vertical xj(V), and lateral xj(L) and with slightly larger xj(L)/xj(V) ratio, than beam-line 11B implant with 2keV energy and 5×1015/cm2 dose. RTP process with 995°C/20s condition demonstrates higher thermal budget than 1015°C/spike condition — cause deeper xj, but with a similar xj(L)/xj(V) ratio. Good correlations among 2D Electron Holography dopant profiles, 2D dopant profile simulations, and 1D SIMS/ARXPS B profiles have been demonstrated. Very good correlation between 2D Electron Holography doping profiles and device parameters has been demonstrated.