柔性OTFT背板的制造转移技术

Toshihiro Yamamoto, Y. Fujisaki, A. Kinoshita, T. Takei, T. Furukawa, H. Fujikake, Y. Nakajima, M. Hosoi
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引用次数: 1

摘要

提出了一种在塑料衬底上实现柔性有机薄膜晶体管的转移技术。该方法的基本原理是在玻璃基板上完成OTFT阵列的所有制造工艺,然后将OTFT转移到塑料薄膜上。利用该技术制备了5.8英寸对角线宽- qqvga OTFT阵列。我们证实,与传统的直接形成方法相比,采用所提出的技术可以抑制衬底变形的程度,并且由于转移过程,OTFT的电特性没有明显的退化。这将是制造具有TFT背板的大型柔性显示器的关键技术。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Transfer technology for fabrication of flexible OTFT backplane
A new transfer technology to realize flexible organic thin film transistors (OTFTs) on a plastic substrate has been developed. The basic principle of the proposed method is that all the fabrication processes for the OTFT array on glass substrate have been completed, and the OTFT is then transferred onto the plastic film. A 5.8-inch diagonal wide-QQVGA OTFT array was fabricated using this technology. We confirmed that degree of substrate deformation with the proposed technology could be suppressed in comparison with that with conventional direct formation method, and also that no significant degradation in the electrical characteristics of the OTFT was observed as a result of the transfer process. It is thought that this will be a key technology for the fabrication of large flexible displays with TFT backplanes.
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