用于毫米波的FinFET -技术和电路设计挑战

Steven Callender, W. Shin, Hyung-Jin Lee, S. Pellerano, C. Hull
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引用次数: 19

摘要

随着下一代通信系统不断向更高的工作频率推进,越来越不确定的是最适合实现这些系统的技术节点。FinFET CMOS是一个可行的候选,提供高密度和低漏的数字晶体管。然而,这些设备的毫米波(mmWave)功能仍然相对未知。在本文中,我们评估了FinFET工艺的毫米波性能,并讨论了在深度缩放技术中毫米波设计的主要挑战,以及克服这些挑战的设计技术和见解。我们还展示了现代FinFET器件对节能毫米波系统设计的适用性,如在英特尔22FFL工艺中实现的75GHz LNA和PA,其性能达到了最先进的水平。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
FinFET for mm Wave - Technology and Circuit Design Challenges
As next-generation communication systems continue to push to higher operating frequencies, one thing that has grown more uncertain is the technology node which is most suitable for implementing these systems. FinFET CMOS is a viable candidate, offering high-density and low-leakage digital transistors. However, the millimeter-wave (mmWave) capabilities of these devices remain relatively unknown by many. In this paper, we assess the mmWave performance of a FinFET process and discuss the key challenges to mmWave design in deeply-scaled technologies along with design techniques and insight to overcome such challenges. We also demonstrate the suitability of modern FinFET devices for the design of energy-efficient mmWave systems as demonstrated by a 75GHz LNA and PA implemented in Intel's 22FFL process which achieve state-of-art performance.
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