GaP/Si基底上GaInP stranski - krstanov岛的OMVPE研究进展

V. Williams, A. Schremer, Y. Naito-Yamada, J. Ballantyne
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引用次数: 0

摘要

与硅芯片的光互连可以大大提高数据传输速率,并降低芯片外通信的功耗。我们的团队正在研究一种方法,通过使用选择性区域有机金属气相外延(OMVPE),将具有低缺陷密度的直接带隙GaInP stranski - krstanov岛与硅电子器件单片集成。近年来,人们成功地在GaP/Si衬底上沉积了光学材料,并首次报道了GaInP/GaP/Si结构的光致发光结果。本文还研究了GaInP岛在GaP衬底上的成核特性以及用该材料体系制备的器件的发光质量。对波导结构的性能进行了测量和描述。在测试GaInP/GaP样品时,观察到紫外照射导致的发光强度下降。光致发光光谱显示,随曝光时间的增加,发射强度显著降低。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Progress on the OMVPE of GaInP Stranski-Krastanov islands on GaP/Si substrates
Optical interconnects to the silicon chip could greatly increase data transmission rates and lower power consumption for off-chip communications. Our group is researching a method by which direct-bandgap GaInP Stranski-Krastanov islands with low defect densities could be monolithically integrated with silicon electronics using selective area organometallic vapor phase epitaxy (OMVPE). Recently, optical material was successfully deposited on GaP/Si substrates, and the photoluminescence results from GaInP/GaP/Si structures are presented for the first time. The nucleation of GaInP islands on GaP substrates and the luminescence quality of devices fabricated from this material system were also investigated. The performance of waveguide structures was measured and is described. During the testing of the GaInP/GaP samples, a degradation in luminescence intensity as a result of UV irradiation was observed. Photoluminescence spectra show a dramatic decrease in emission intensity as a function of exposure time.
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