高性能通用处理器中的内置自检注意事项

S. Sarma
{"title":"高性能通用处理器中的内置自检注意事项","authors":"S. Sarma","doi":"10.1109/TEST.1991.519489","DOIUrl":null,"url":null,"abstract":"The intent of this paper is to describe the built-in-self-test (BIST) design and verification methodology followed for thermal conduction modules (TCMs) in the aircooled IBM Enterprise System/9000 Type 9121 processors. The ES/9121 processor utilizes a mixture of bipolar and CMOS circuitry. Each ES/9121 processor TCM can accommodate a maximum of 121 logic and memory chips. There are five distinct TCMs in the uniprocessor configuration and the testability results achieved using BIST will be presented in this paper. The resources required to support the BIST process will also be presented. Finally, improvements to the BIST methodology will be discussed.","PeriodicalId":272630,"journal":{"name":"1991, Proceedings. International Test Conference","volume":"25 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1991-10-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Built-in-self-test considerations in a high-performance, general-purpose processor\",\"authors\":\"S. Sarma\",\"doi\":\"10.1109/TEST.1991.519489\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The intent of this paper is to describe the built-in-self-test (BIST) design and verification methodology followed for thermal conduction modules (TCMs) in the aircooled IBM Enterprise System/9000 Type 9121 processors. The ES/9121 processor utilizes a mixture of bipolar and CMOS circuitry. Each ES/9121 processor TCM can accommodate a maximum of 121 logic and memory chips. There are five distinct TCMs in the uniprocessor configuration and the testability results achieved using BIST will be presented in this paper. The resources required to support the BIST process will also be presented. Finally, improvements to the BIST methodology will be discussed.\",\"PeriodicalId\":272630,\"journal\":{\"name\":\"1991, Proceedings. International Test Conference\",\"volume\":\"25 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1991-10-26\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"1991, Proceedings. International Test Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/TEST.1991.519489\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"1991, Proceedings. International Test Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/TEST.1991.519489","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

摘要

本文的目的是描述风冷IBM企业系统/9000型9121处理器中的热传导模块(tcm)的内置自测(BIST)设计和验证方法。ES/9121处理器采用双极和CMOS电路的混合。每个ES/9121处理器TCM最多可容纳121个逻辑和存储芯片。在单处理器配置中有五种不同的tcm,本文将介绍使用BIST获得的可测试性结果。还将介绍支持BIST过程所需的资源。最后,将讨论改进的BIST方法。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Built-in-self-test considerations in a high-performance, general-purpose processor
The intent of this paper is to describe the built-in-self-test (BIST) design and verification methodology followed for thermal conduction modules (TCMs) in the aircooled IBM Enterprise System/9000 Type 9121 processors. The ES/9121 processor utilizes a mixture of bipolar and CMOS circuitry. Each ES/9121 processor TCM can accommodate a maximum of 121 logic and memory chips. There are five distinct TCMs in the uniprocessor configuration and the testability results achieved using BIST will be presented in this paper. The resources required to support the BIST process will also be presented. Finally, improvements to the BIST methodology will be discussed.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信