基于薄膜载体的激光二极管阵列封装新技术

Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) Pub Date : 1993-06-01 DOI:10.1109/ECTC.1993.346755

M. Usui, K. Katsura, T. Hayashi, M. Hosoya, K. Sato, S. Sekine, H. Toba

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引用次数: 5

摘要

提出了一种新颖的激光二极管阵列封装技术。该技术采用了一种新型的薄膜载体，它在聚酰亚胺薄膜上具有高密度的内引线和微带线。与我们传统使用的由键合线和Al/sub 2/O/sub 3/电路板组成的布线结构相比，薄膜载体上的线路之间的互感较小。这种结构可以减少LD阵列上通道间的电串扰。利用上述技术制作了一个4通道LD阵列子模块，并进行了演示。该模块在2.3 GHz带宽范围内具有良好的频率特性。相邻ld之间的电串扰在1ghz时小于- 30db。该值比传统布线结构低约10db。

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Novel packaging technique for laser diode arrays using film carrier

An innovative packaging technique for laser diode (LD) arrays has been developed. This technique uses a new film carrier which has high-density inner leads and microstrip lines on polyimide film. There is less mutual inductance between lines on the film carrier than with the wiring structure we conventionally use which comprises bonding wire and Al/sub 2/O/sub 3/ circuit board. This structure can reduce the electrical crosstalk between channels on the LD array. A 4-channel LD array sub-module is fabricated employing the above technique, and demonstrated. The module has good frequency characteristics over a bandwidth of 2.3 GHz. The electrical crosstalk between adjacent LDs is less than -30 dB at 1 GHz. This value is about 10 dB lower than with the conventional wiring structure.<>

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Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93)

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