{"title":"用于pc放大器的芯片和塑料封装HBT的负载-拉特性和建模","authors":"G. Henderson, Der-woei Wu","doi":"10.1109/ARFTG.1995.327131","DOIUrl":null,"url":null,"abstract":"GaAs HBT’s are excellent candidates for PCS power amplifier applications which require a single low-voltage supply with good efficiency and linearity [l]. This paper describes the characterization and modeling of M/A-COM’s chip and plastic-packaged HBT for linear power amplifier applications at 1.88GHz. This analysis includes (1) a discussion of the device and package characteristics required for PCS amplifier applications (2) a complete load-pull characterization for power, efficiency, and linearity (3) a discussion of how these contours can be used to identify optimum matching conditions for linear amplifier design, and (4) the development and demonstration of a complete large-signal chip and packaged device model that accurately predicts the measured power, efficiency, and linearity. Through this analysis it is shown that for the GaAs HBT a significant improvement can be achieved in amplifier linearity by trading the device gain for linearity through an appropriate output termination.","PeriodicalId":403073,"journal":{"name":"46th ARFTG Conference Digest","volume":"29 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1995-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"Load-Pull Characterization and Modeling of Chip and Plastic Packaged HBT'S for PCS Amplifier Applications\",\"authors\":\"G. Henderson, Der-woei Wu\",\"doi\":\"10.1109/ARFTG.1995.327131\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"GaAs HBT’s are excellent candidates for PCS power amplifier applications which require a single low-voltage supply with good efficiency and linearity [l]. This paper describes the characterization and modeling of M/A-COM’s chip and plastic-packaged HBT for linear power amplifier applications at 1.88GHz. This analysis includes (1) a discussion of the device and package characteristics required for PCS amplifier applications (2) a complete load-pull characterization for power, efficiency, and linearity (3) a discussion of how these contours can be used to identify optimum matching conditions for linear amplifier design, and (4) the development and demonstration of a complete large-signal chip and packaged device model that accurately predicts the measured power, efficiency, and linearity. Through this analysis it is shown that for the GaAs HBT a significant improvement can be achieved in amplifier linearity by trading the device gain for linearity through an appropriate output termination.\",\"PeriodicalId\":403073,\"journal\":{\"name\":\"46th ARFTG Conference Digest\",\"volume\":\"29 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1995-11-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"46th ARFTG Conference Digest\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ARFTG.1995.327131\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"46th ARFTG Conference Digest","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ARFTG.1995.327131","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Load-Pull Characterization and Modeling of Chip and Plastic Packaged HBT'S for PCS Amplifier Applications
GaAs HBT’s are excellent candidates for PCS power amplifier applications which require a single low-voltage supply with good efficiency and linearity [l]. This paper describes the characterization and modeling of M/A-COM’s chip and plastic-packaged HBT for linear power amplifier applications at 1.88GHz. This analysis includes (1) a discussion of the device and package characteristics required for PCS amplifier applications (2) a complete load-pull characterization for power, efficiency, and linearity (3) a discussion of how these contours can be used to identify optimum matching conditions for linear amplifier design, and (4) the development and demonstration of a complete large-signal chip and packaged device model that accurately predicts the measured power, efficiency, and linearity. Through this analysis it is shown that for the GaAs HBT a significant improvement can be achieved in amplifier linearity by trading the device gain for linearity through an appropriate output termination.
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