Xingsong Su, Lifei Lai, Chang Li, Wenjun Liu, Xianzhu Fu, R. Sun, C. Wong
{"title":"化学镀合金薄膜埋入电阻材料","authors":"Xingsong Su, Lifei Lai, Chang Li, Wenjun Liu, Xianzhu Fu, R. Sun, C. Wong","doi":"10.1109/ICEPT.2015.7236584","DOIUrl":null,"url":null,"abstract":"Ni-P alloy thin films are prepared by electroless plating as embedded thin-film resistor (ETFR) materials. The micro-structure, electrical, thermal, mechanical, and corrosion-resistant properties of Ni-P alloy thin films are investigated to optimize the electroless plating conditions. When the phosphorus content was greater than 9 %, Ni-P alloy thin films are amorphous. Ni-P alloy thin films' sheet resistance, corrosion resistance and hardness increase with the increase of P content.","PeriodicalId":415934,"journal":{"name":"2015 16th International Conference on Electronic Packaging Technology (ICEPT)","volume":"17 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2015-09-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Electroless plating alloy thin-film embedded resistor materials\",\"authors\":\"Xingsong Su, Lifei Lai, Chang Li, Wenjun Liu, Xianzhu Fu, R. Sun, C. Wong\",\"doi\":\"10.1109/ICEPT.2015.7236584\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Ni-P alloy thin films are prepared by electroless plating as embedded thin-film resistor (ETFR) materials. The micro-structure, electrical, thermal, mechanical, and corrosion-resistant properties of Ni-P alloy thin films are investigated to optimize the electroless plating conditions. When the phosphorus content was greater than 9 %, Ni-P alloy thin films are amorphous. Ni-P alloy thin films' sheet resistance, corrosion resistance and hardness increase with the increase of P content.\",\"PeriodicalId\":415934,\"journal\":{\"name\":\"2015 16th International Conference on Electronic Packaging Technology (ICEPT)\",\"volume\":\"17 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2015-09-03\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2015 16th International Conference on Electronic Packaging Technology (ICEPT)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICEPT.2015.7236584\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 16th International Conference on Electronic Packaging Technology (ICEPT)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICEPT.2015.7236584","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Ni-P alloy thin films are prepared by electroless plating as embedded thin-film resistor (ETFR) materials. The micro-structure, electrical, thermal, mechanical, and corrosion-resistant properties of Ni-P alloy thin films are investigated to optimize the electroless plating conditions. When the phosphorus content was greater than 9 %, Ni-P alloy thin films are amorphous. Ni-P alloy thin films' sheet resistance, corrosion resistance and hardness increase with the increase of P content.
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