多核处理器中线程迁移与DVFS的兼容性分析

Dongkeun Oh, C. C. Chen, N. Kim, Y. Hu
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引用次数: 4

摘要

将多个核心集成到处理器中会显著增加热密度,这通常会限制此类处理器的最大性能。在热约束的多核处理器中,有许多技术使用动态电压和频率缩放(DVFS)和线程迁移来控制散热。然而,大多数方法都是单独分析和应用于多核处理器的性能优化,而对其优化的计算成本研究较少。在本文中,我们认为两种技术的一致组织可以最大限度地提高多核处理器的性能,并且与热管理技术相关的性能开销最小。此外,我们还提出了一种有效的方法来优化热约束多核处理器的性能。根据我们的实验,我们在计算成本可以忽略不计的情况下实现了5%的吞吐量提升。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
The compatibility analysis of thread migration and DVFS in multi-core processor
Integrating multiple cores into a processor increases the heat density significantly, which often constrains the maximum performance of such a processor. There have been many techniques using dynamic voltage and frequency scaling (DVFS) and thread migration to manipulate heat dissipation in thermally-constrained multi-core processors. However, most of them were analyzed and applied individually for optimizing the performance of the multi-core processors while their computational cost for the optimization was not studied well. In this paper, we argue that a coherent organization of two techniques can maximize the performance of the multi-core processors with the least performance overheads associated with the thermal management techniques. Furthermore, we also propose an efficient method to optimize the performance of thermal-constrained multi-core processors. According to our experiment, we achieved 5% throughput improvement with negligible computation cost.
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