通过DLTS、电学表征和TCAD仿真研究沟槽功率MOSFET中BVdss的不稳定性

Marina Ruggeri, P. Calenzo, F. Morancho, L. Masoero, R. Germana, Alessandro Nodari, R. Monflier
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引用次数: 0

摘要

本文研究了屏蔽栅MOSFET (SG-MOSFET)结构雪崩电流漏极应力时漏极到源击穿电压(BVdss)的不稳定性,并提出了一种将电学结果与TCAD模拟相关联的新方法。电容深能级瞬态光谱(c - dlt)证实了电场板(FP)氧化物/硅界面正电荷态的存在。因此,它在TCAD仿真中实现,预测了两种体系结构的实验行为。由于这些结果,随机贡献者被区分为建议一种途径,以增加设备的鲁棒性,同时产生轻微的Ron影响。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Investigation of BVdss instability in trench power MOSFET through DLTS, electrical characterization and TCAD simulations
In this paper, we investigated the drain to source breakdown voltage (BVdss) instability during avalanche current drain stress of Shielded Gate MOSFET (SG-MOSFET) structure and we propose a new methodology to correlate electrical results to TCAD simulations. The presence of positive charged states at the Field Plate (FP) oxide/Si interface was confirmed by Capacitance Deep Level Transient Spectroscopy (C-DLTS). Thus, it was implemented in TCAD simulations that predict the experimental behavior of two architectures. Thanks to these results, walk-in contributors were discriminated to suggest a pathway to increase device robustness with a slight Ron impact.
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