用氦和氢稀释法制备高质量a-(Si,Ge):H合金的生长和性能

V. Dalal, Y. Liu, P. Sharma
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引用次数: 0

摘要

我们报道了用氢和氦稀释制备的a-(Si,Ge):H薄膜和器件的生长和性能。薄膜和器件采用远程ECR等离子体放电生长。氦稀释比仅使用氢稀释可获得更高的生长速率。发现氢的稀释对于获得良好的电子性能总是必要的。利用光电导率和亚间隙吸收测量对膜进行了表征。在类器件样品中使用空间电荷限制电流测量缺陷密度。结果表明,Urbach能低于50 meV,子隙/spl α / /spl sim/ 1/cm的薄膜可以生长到1.33 eV的Tauc带隙。缺陷密度随Ge含量的增加而增加,但仍在1 ~ 2 /spl倍/ 10/sup / 16/ /cm/sup 3/-eV范围内。在这些材料中制备了衬底型p-i-n器件,获得了良好的填充系数。对薄膜和装置进行了稳定性测试。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Growth and properties of high quality a-(Si,Ge):H alloys using helium and hydrogen dilution
We report on the growth and properties of a-(Si,Ge):H films and devices prepared using dilution with both hydrogen and helium. The films and devices were grown using a remote ECR plasma discharge. Helium dilution allowed for a higher growth rate than achieved using only hydrogen dilution. It was found that hydrogen dilution was always necessary to achieve good electronic properties. The films were characterized using photoconductivity and subgap absorption measurements. Defect density was measured using space-charge limited current in device-like samples. It was found that good quality films, with Urbach energies below 50 meV, and subgap /spl alpha/ /spl sim/ 1/cm could be grown down to a Tauc bandgap of 1.33 eV. The defect densities increased with increasing Ge content, but were still in the range of 1-2 /spl times/ 10/sup 16/ /cm/sup 3/-eV. Substrate-type p-i-n devices were fabricated in these materials, and good fill factors were obtained. The films and devices were tested for stability.
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