{"title":"用透射电镜纳米束衍射分度技术鉴定铜-铝金属间相","authors":"F. K. Yong","doi":"10.1109/IPFA.2014.6898172","DOIUrl":null,"url":null,"abstract":"The paper shares the application of electron diffraction spot indexing to identify intermetallic phases in copper wire bond. Standard Scanning Transmission Electron Microscopy (STEM) technique with a converged electron probe was modified to produce parallel nano beam for forming electron diffraction spot patterns, CuAl(η2)and CuAl2(θ) phases in copper wire bond were identified by indexing the diffraction spots.","PeriodicalId":409316,"journal":{"name":"Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)","volume":"8 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2014-09-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Identification of Cu-Al intermetallic phases of copper wire bonding using TEM nano beam diffraction indexing technique\",\"authors\":\"F. K. Yong\",\"doi\":\"10.1109/IPFA.2014.6898172\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The paper shares the application of electron diffraction spot indexing to identify intermetallic phases in copper wire bond. Standard Scanning Transmission Electron Microscopy (STEM) technique with a converged electron probe was modified to produce parallel nano beam for forming electron diffraction spot patterns, CuAl(η2)and CuAl2(θ) phases in copper wire bond were identified by indexing the diffraction spots.\",\"PeriodicalId\":409316,\"journal\":{\"name\":\"Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)\",\"volume\":\"8 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2014-09-18\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IPFA.2014.6898172\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IPFA.2014.6898172","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Identification of Cu-Al intermetallic phases of copper wire bonding using TEM nano beam diffraction indexing technique
The paper shares the application of electron diffraction spot indexing to identify intermetallic phases in copper wire bond. Standard Scanning Transmission Electron Microscopy (STEM) technique with a converged electron probe was modified to produce parallel nano beam for forming electron diffraction spot patterns, CuAl(η2)and CuAl2(θ) phases in copper wire bond were identified by indexing the diffraction spots.